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 2N5194, 2N5195
Preferred Devices
Silicon PNP Power Transistors
These devices are designed for use in power amplifier and switching circuits; excellent safe area limits. Complement to NPN 2N5191, 2N5192.
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* Pb-Free Packages are Available*
MAXIMUM RATINGS (Note 1)
Rating
Symbol VCEO VCB VEB IC IB
2N5194 60 60
2N5195 80 80
Unit Vdc Vdc Vdc Adc Adc
4 AMPERE POWER TRANSISTORS PNP SILICON 60 - 80 VOLTS
II II IIIIIIIIIIIIIIIIIII I I II II IIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIII I II I II I II IIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIII I II II IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I I II II IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIII I III II I I I I IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I III I III IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII II II I I I IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII I III IIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII
Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Base Current 5.0 4.0 1.0 Total Device Dissipation @ TC = 25C Derate above 25C Operating and Storage Junction Temperature Range PD 40 320 W W/C C/W TJ, Tstg - 65 to + 150
TO-225AA CASE 77-09 STYLE 1
THERMAL CHARACTERISTICS
Characteristic
Symbol qJC
Max
Unit
MARKING DIAGRAM
Thermal Resistance, Junction-to-Case
3.12
C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Indicates JEDEC registered data.
YWW 2 N519xG
Y WW 2N519x G
= Year = Work Week = Device Code x = 4 or 5 = Pb-Free Package
ORDERING INFORMATION
Device 2N5194 2N5194G 2N5195 2N5195G Package TO-225 TO-225 (Pb-Free) TO-225 TO-225 (Pb-Free) Shipping 500 Units / Bulk 500 Units / Bulk 500 Units / Bulk 500 Units / Bulk
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
Preferred devices are recommended choices for future use and best overall value.
1
October, 2006 - Rev. 12
Publication Order Number: 2N5194/D
II II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I III I I I I II II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII I I I II I II IIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
2. Indicates JEDEC registered data. 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%. DYNAMIC CHARACTERISTICS ON CHARACTERISTICS OFF CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) (Note 2)
Current-Gain -- Bandwidth Product (IC = 1.0 Adc, VCE = 10 Vdc, f = 1.0 MHz)
Base-Emitter On Voltage (Note 3) (IC = 1.5 Adc, VCE = 2.0 Vdc)
Collector-Emitter Saturation Voltage (Note 3) (IC = 1.5 Adc, IB = 0.15 Adc) (IC = 4.0 Adc, IB = 1.0 Adc)
DC Current Gain (Note 3) (IC = 1.5 Adc, VCE = 2.0 Vdc)
Emitter Cutoff Current (VBE = 5.0 Vdc, IC = 0)
Collector Cutoff Current (VCB = 60 Vdc, IE = 0) (VCB = 80 Vdc, IE = 0)
Collector Cutoff Current (VCE = 60 Vdc, VBE(off) = 1.5 Vdc) (VCE = 80 Vdc, VBE(off) = 1.5 Vdc) (VCE = 60 Vdc, VBE(off) = 1.5 Vdc, TC = 125_C) (VCE = 80 Vdc, VBE(off) = 1.5 Vdc, TC = 125_C)
Collector Cutoff Current (VCE = 60 Vdc, IB = 0) (VCE = 80 Vdc, IB = 0)
Collector-Emitter Sustaining Voltage (Note 3) (IC = 0.1 Adc, IB = 0)
0.1 0.004
hFE , DC CURRENT GAIN (NORMALIZED)
0.3
1.0 0.7 0.5
10 7.0 5.0
0.2
2.0
3.0
(IC = 4.0 Adc, VCE = 2.0 Vdc)
TJ = 150C
0.007 0.01
25C
0.02
Characteristic
-55 C
0.03
0.05 0.1 0.2 0.3 IC, COLLECTOR CURRENT (AMP)
Figure 1. DC Current Gain
2N5194, 2N5195
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2N5194 2N5195 2N5194 2N5195 2N5194 2N5195 2N5194 2N5195 2N5194 2N5195 2N5194 2N5195 2N5194 2N5195 VCEO(sus) Symbol VCE(sat) VBE(on) ICBO ICEO IEBO ICEX 0.5 hFE fT 1.0 Min 2.0 25 20 10 7.0 60 80 - - - - - - - - - - - - 2.0 VCE = 2.0 V VCE = 10 V Max 100 80 - - 1.2 0.6 1.4 1.0 0.1 0.1 0.1 0.1 2.0 2.0 1.0 1.0 - - - 3.0 4.0 mAdc mAdc mAdc mAdc MHz Unit Vdc Vdc Vdc -
2
2N5194, 2N5195
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS) 2.0 1.6
1.2
IC = 10 mA
100 mA
1.0 A
3.0 A
0.8 TJ = 25C
0.4
0 0.05 0.07 0.1
0.2
0.3
0.5 0.7
1.0
2.0
3.0 5.0 7.0 10 IB, BASE CURRENT (mA)
20
30
50
70
100
200
300
500
Figure 2. Collector Saturation Region
V, TEMPERATURE COEFFICIENTS (mV/C)
2.0 TJ = 25C 1.6 VOLTAGE (VOLTS)
+2.5 +2.0 +1.5 +1.0 +0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 0.005 0.01 0.020.03 0.05
*APPLIES FOR IC/IB hFE @ VCE TJ = -65C to +150C
1.2
*qVC for VCE(sat)
0.8
VBE(sat) @ IC/IB = 10
VBE @ VCE = 2.0 V
0.4 VCE(sat) @ IC/IB = 10 0 0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 4.0
qVB for VBE
0.1
0.2 0.3 0.5
1.0
2.0 3.0 4.0
IC, COLLECTOR CURRENT (AMP)
IC, COLLECTOR CURRENT (AMP)
Figure 3. "On" Voltage
RBE , EXTERNAL BASE-EMITTER RESISTANCE (OHMS)
Figure 4. Temperature Coefficients
103 VCE = 30 Vdc IC, COLLECTOR CURRENT ( A) 102 TJ = 150C 101 100 100C REVERSE 25C ICES 0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6
107 VCE = 30 V 106 IC = 10 x ICES 105 IC = 2 x ICES 104 103 102 20 IC ICES
10-1
FORWARD
10- 2
(TYPICAL ICES VALUES OBTAINED FROM FIGURE 5)
10- 3 +0.4 +0.3 +0.2 +0.1
40
60
80
100
120
140
160
VBE, BASE-EMITTER VOLTAGE (VOLTS)
TJ, JUNCTION TEMPERATURE (C)
Figure 5. Collector Cut-Off Region
Figure 6. Effects of Base-Emitter Resistance
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3
2N5194, 2N5195
TURN-ON PULSE VBE(off) Vin 0 APPROX -11 V VCC Vin RC RB SCOPE CAPACITANCE (pF) 500 TJ = 25C 300 200
t1 t2
Cjd << Ceb APPROX +9.0 V +4.0 V RB AND RC VARIED TO OBTAIN DESIRED CURRENT LEVELS t1 7.0 ns 100 < t2 < 500 ms t3 < 15 ns DUTY CYCLE 2.0%
100 70 50
Ceb Ccb
Vin APPROX -11 V t3 TURN-OFF PULSE
0.1
0.2 0.3
0.5
1.0
2.0 3.0
5.0
10
20 30 40
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Switching Time Equivalent Test Circuit
2.0 1.0 0.7 0.5 t, TIME ( s) 0.3 0.2 0.1 0.07 0.05 tr @ VCC = 10 V tr @ VCC = 30 V IC/IB = 10 TJ = 25C 2.0 1.0 0.7 0.5 t, TIME ( s) 0.3 0.2 ts
Figure 8. Capacitance
IB1 = IB2 IC/IB = 10 ts = ts - 1/8 tf TJ = 25C tf @ VCC = 30 V
0.1 0.07 0.05 0.03 0.02 0.05 0.07 0.1
tf @ VCC = 10 V
td @ VBE(off) = 2.0 V 0.03 0.02 0.2 0.3 0.05 0.07 0.1 0.5 0.7 1.0 IC, COLLECTOR CURRENT (AMP)
2.0
3.0 4.0
0.2 0.3 0.5 0.7 1.0 IC, COLLECTOR CURRENT (AMP)
2.0 3.0 4.0
Figure 9. Turn-On Time Note 1:
5.0 ms TJ = 150C dc SECONDARY BREAKDOWN LIMIT THERMAL LIMIT @ TC = 25C BONDING WIRE LIMIT CURVES APPLY BELOW RATED VCEO 2N5194 2N5195 2.0 5.0 10 20 50 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS) 100 1.0 ms 100 ms
Figure 10. Turn-Off Time
10 IC, COLLECTOR CURRENT (AMP) 5.0 2.0 1.0 0.5 0.2 0.1 1.0
There are two limitations on the power handling ability of a transistor; average junction temperature and second breakdown. Safe operating area curves indicate I C - V CE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 11 is based on T J(pk) = 150_C. T C is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T J(pk) v 150_C. At high-case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.
Figure 11. Rating and Thermal Data Active-Region Safe Operating Area
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4
2N5194, 2N5195
r(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 0.7 0.5 0.3 0.2 0.05 0.02 SINGLE PULSE 0.01
D = 0.5 0.2 0.1
qJC(max) = 3.12C/W
0.1 0.07 0.05 0.03 0.02 0.01 0.01
0.02 0.03
0.05
0.1
0.2 0.3
0.5
1.0 2.0 3.0 5.0 10 t, TIME OR PULSE WIDTH (ms)
20
30
50
100
200 300
500
1000
Figure 12. Thermal Response
DESIGN NOTE: USE OF TRANSIENT THERMAL RESISTANCE DATA
tP PP PP
t1 1/f t1 tP PEAK PULSE POWER = PP DUTY CYCLE, D = t1 f =
A train of periodical power pulses can be represented by the model shown in Figure 13. Using the model and the device thermal response, the normalized effective transient thermal resistance of Figure 12 was calculated for various duty cycles. To find qJC(t), multiply the value obtained from Figure 12 by the steady state value qJC. Example: The 2N5193 is dissipating 50 watts under the following conditions: t1 = 0.1 ms, tp = 0.5 ms. (D = 0.2). Using Figure 12, at a pulse width of 0.1 ms and D = 0.2, the reading of r(t1, D) is 0.27. The peak rise in junction temperature is therefore:
DT = r(t) x PP x qJC = 0.27 x 50 x 3.12 = 42.2_C
Figure 13.
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5
2N5194, 2N5195
PACKAGE DIMENSIONS
TO-225 CASE 77-09 ISSUE Z
-B- U Q
F M
C
-A-
123
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 077-01 THRU -08 OBSOLETE, NEW STANDARD 077-09. INCHES MIN MAX 0.425 0.435 0.295 0.305 0.095 0.105 0.020 0.026 0.115 0.130 0.094 BSC 0.050 0.095 0.015 0.025 0.575 0.655 5_ TYP 0.148 0.158 0.045 0.065 0.025 0.035 0.145 0.155 0.040 --- MILLIMETERS MIN MAX 10.80 11.04 7.50 7.74 2.42 2.66 0.51 0.66 2.93 3.30 2.39 BSC 1.27 2.41 0.39 0.63 14.61 16.63 5 _ TYP 3.76 4.01 1.15 1.65 0.64 0.88 3.69 3.93 1.02 ---
H
K
V G S D 2 PL 0.25 (0.010)
M
J R 0.25 (0.010) A
M
A
M
M
B
M
B
M
DIM A B C D F G H J K M Q R S U V
STYLE 1: PIN 1. EMITTER 2. COLLECTOR 3. BASE
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6
2N5194/D


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